| 產品名稱： | 六層板手機主板盲埋BGA |
| 表面處理： | 化金+OSP |
| 最小過孔： | 0.1MM |
| 線寬線距： | 0.08MM |
| 應用行業或產品 | 通訊 |
E-mail: hh@faiwong.net
Tel: +86-13147074003
Fax: +86-0852-24577440
Hong Kong Address: 14F/C, Kenji Building, No. 9 San On Street, Tuen Mun, Hong Kong
Tel: +86-755-27908020
Fax: +86-13147074003
Factory Address: Building 2, Yongli Industrial Center, Tongda Road, Gushu Village, Xixiang Town, Baoan District, Shenzhen
Wechat
+86-13147074003
專業一對一的服務
單面 雙面 多層電路板 軟板 及鋁基板
QQ
QQ
Double-sided MLB
FPC 8 Layer
FPC 6 Layer
FPC 1Layer
Six Layer Flexible-Rigid PCB
PCB KB-6150 FR4 94VO 2OZ 4Layer Imme Gold - Bevelling Gold Finger
PCB KB-5150 CEM-1 2OZ Single Side
PCB KB-3151 FR1 94VO 1OZ Single Side